SK Hynix Inc. is accelerating the launch of its next-generation AI memory chips after Nvidia Corp. Chief Executive Officer Jensen Huang asked the South Korean supplier if it can provide samples six months earlier than originally planned,

Nvidia has asked SK hynix to move up its delivery timeline for next-generation HBM4 memory chips by six months, according to SK Group Chairman Chey Tae-won, reports Reuters.

SK Hynix, the world’s second-largest memorychip maker, is racing to meet explosive demand for the high-bandwidth memory (HBM) chips that are used to process vast amounts of data to train AI, including from Nvidia, which dominates the market.

Citing the growing demand for high-capacity, energy-efficient semiconductors, Nvidia CEO Jensen Huang asks SK Hynix to accelerate the delivery of the HBM4 chip by six months. This year, SK Hynix plans to provide 12-layer HBM3E samples,

Nvidia CEO Jensen Huang had asked memory chip maker SK Hynix to bring forward by six months the supply of its next-generation high-bandwidth memory chips called HBM4, SK Group Chairman Chey Tae-won said on Monday.

SK Group Chair Chey Tae-won said Nvidia CEO Jensen Huang asked him if SK Hynix could move the supply of high-bandwith memory (HBM) chips forward by six months.

HBM3E hardly off the manufacturing line Nvidia CEO Jensen Huang asked Korean chipmaker SK hynix to pull forward delivery of 12-layer HBM4 chips by half a year, according to the company's group chairman Chey Tae-won.

Nvidia CEO Jensen Huang requested SK hynix to speed up the supply of next-generation high-bandwidth memory (HBM) chips during his meeting with SK Group Chairman Chey Tae-won, in light of the unprecedented demand for semiconductors used in artificial intelligence (AI),