The increasing adoption of AI in edge devices, coupled with a growing demand for new features, is forcing chipmakers to rethink when and where data gets processed, what kind of processors to use, and ...

Some vehicles can have nearly 40 different harnesses to connect all the ICs. Like so much of the semiconductor industry, the automotive industry is now turning towards 3D-IC design techniques to help ...

While PIR sensors are inexpensive, radar technologies are decreasing in cost and becoming more compact and simple to design. Radar solutions can range from simple motion detection to complex imaging ...

The future of hearing aids lies in further miniaturization and functionality enhancement. Hearing is one of the most essential senses for engaging with the world. It enables us to converse, appreciate ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...

Cheap imports are ratcheting up pressure on traditional carmakers, but changes are more difficult than anticipated.

Lithium batteries dominate today’s rechargeable battery market, and while they have been wildly successful, challenges with lithium have spurred research into alternative chemistries that can improve ...

Network security protocols are the primary means of securing data in motion; that is, data communicated between closely connected physical devices or between devices and even virtual machines ...

Leveraging PUF technology to add a strong, secure root key to almost any IoT device without requiring changes in the SoC’s hardware.

The automotive industry is undergoing a rapid transformation, with connectivity and automation becoming integral components of modern vehicles. However, this increased connectivity also brings ...

Key features of SONOS-based NVM and suitability for rad-hard applications.

A new technical paper titled “Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically” was published by ...