Design-Reuse19h
HPC customer engages Sondrel for high end chip design
Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and ...
Design-Reuse2d
World's First CXL 3.1 Multi-Vendor Interoperability Demo Showcases New Memory Possibilities for Hyperscale Data Centers
Traditional interconnects have been unable to deliver the bandwidth, latency, and power efficiency needs of hyperscale data ...
Design-Reuse1d
Redefining XPU Memory for AI Data Centers Through Custom HBM4 - Part 2
HBM implementation challenges This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into ...
Design-Reuse3d
TSMC drives A16, 3D process technology
TSMC is looking to introduce its A16 1.6nm process by the end of 2026 with an IEEE standard for its 3Dblox technology.
Design-Reuse4d
Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
Designers of aerospace and defense systems know that their applications are mission-critical and demand the highest levels of ...
Design-Reuse4d
Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
MOUNTAIN VIEW, Calif., November 18, 2024 – Esperanto Technologies™, a leading developer of RISC-V chips and software for high ...
Design-Reuse4d
Behind the Scenes - Introducing Xiphera's Board
Xiphera’s board of five includes company’s co-founders and three other people from different backgrounds. The new board is filled with new kind of ...